Description

Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.

Features

Channel Polarity: P-Channel
Max. Continuous Drain Current (@Tc=25°C): -10A
Max. Pulsed Drain Current: -45A
Max. Power Dissipation: 2.5W
Max. Static Drain-to-Source On-Resistance: 20mΩ
Min. Drain-to-Source Breakdown Voltage: -30V
Gate Threshold Voltage: (Min)-1V, (Max)-2.04V
Turn-On Delay Time: 18ns
Rise Time: 49ns
Turn-Off Delay Time: 59ns
Fall Time: 60ns
Package: SO-8 (SOP-8)