Features

• Glass passivated chip junction
• Available in unidirectional and bidirectional
• 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 %
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• AEC-Q101 qualified

Ratings

Minimum breakdown voltage: 143V
Maxiumum peak pulse current: 2.9A
Maximum clamping voltage: 207V
Peak forward surge current 8.3 ms single half sine-wave: 100A

Typical applications

Use in sensitive electronics protection against voltage
transients induced by inductive load switching and lighting
on ICs, MOSFET, signal lines of sensor units for consumer,
computer, industrial, automotive, and telecommunication.